Technoform Low Lambda Polyamide Thermal Barriers Improve Thermal Performance

Technoform Low Lambda Polyamide (PA) thermal barriers aim to improve performance in windows, doors and façade systems. Achieving higher thermal performance with lower assembly U-factors and better condensation resistance, this advancement in PA technology helps fenestration product manufacturers meet U.S. and Canadian energy codes.

Product details

Technoform’s thermal barrier innovation reduces the conductivity of the PA material itself. Lower conductivity PA, often referred to as “low lambda,” allows lower assembly U-factors in aluminum framing designs, without widening the thermal barrier. This efficient and cost-effective approach simplifies manufacturing and supply chain complexity, say company officials.

Technoform Low Lambda PA 66 GF25 special glass fiber-reinforced, dry impact-resistant mixture has a lambda value of 0.198 watter per meter-Kelvin (W/(m•K), which is more than a 30% improvement over standard PA. 
 
“It’s now possible to improve the performance of an existing product’s design without changing extrusions, simply by substituting the existing barrier with one made of lower-conductivity PA,” says Technoform’s Bill Blazek.
 
To see the product in person, visit Technoform representatives in booth #2215 at GlassBuild America, Sept. 23-25 at the Las Vegas Convention Center.